Opportunity Information: Apply for 2025 NIST CHIPS NAPMP 01
The National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Research and Development (R&D) funding opportunity is a discretionary federal grant competition run by the National Institute of Standards and Technology (NIST) under CFDA 11.042. It is designed to speed up and strengthen domestic capabilities in semiconductor advanced packaging, with a clear emphasis on the kinds of packaging breakthroughs needed to support modern computing demands such as high performance computing and low-power electronics, both of which are central to scaling artificial intelligence (AI) hardware. In practical terms, the program is looking for R&D projects that can help the United States move faster from promising ideas to reliable, manufacturable advanced packaging technologies, and that can help build an enduring U.S. advanced packaging ecosystem rather than one-off prototypes.
The Notice of Funding Opportunity (NOFO) targets five specific R&D areas. First, it supports work on equipment, tools, processes, and process integration, meaning proposals that improve the manufacturing toolchain and the way packaging steps fit together into a stable, high-yield production flow. Second, it funds advances in power delivery and thermal management, reflecting the reality that today s dense, high-power chips are increasingly limited by heat removal and by delivering clean power efficiently to complex 2.5D/3D assemblies. Third, it calls for connector technology, including photonics and radio frequency (RF), which points to the need for better high-bandwidth, low-loss ways to move data in and out of packaged systems, including optical and high-frequency interconnect approaches. Fourth, it emphasizes the chiplets ecosystem, signaling an interest in modular design approaches where multiple dies from potentially different sources are integrated into one package, which requires standards, interfaces, assembly approaches, testing strategies, and supply chain coordination. Fifth, it supports co-design and electronic design automation (EDA), recognizing that advanced packaging performance depends on tightly coordinated chip, package, and system design and on software tooling that can model, optimize, and verify these complex multi-die systems.
Eligibility is broad but strictly domestic. Applicants may include U.S.-based non-profit organizations, domestic accredited institutions of higher education, and State, local, and Tribal governments, as well as domestic for-profit organizations. To qualify as domestic, an entity must be incorporated in the United States (including U.S. territories) and have its principal place of business in the United States (including U.S. territories). The funding opportunity number is 2025 NIST CHIPS NAPMP 01, and NIST expects to make about 10 awards. The opportunity was created on 2024-10-18, and the original application closing date is 2024-12-20. The award ceiling is not listed in the provided source data, so applicants would need to consult the full NOFO for detailed budget limits, cost share requirements (if any), and evaluation criteria.Apply for 2025 NIST CHIPS NAPMP 01
- The National Institute of Standards and Technology in the science and technology and other research and development sector is offering a public funding opportunity titled "National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Research and Development (R&D)" and is now available to receive applicants.
- Interested and eligible applicants and submit their applications by referencing the CFDA number(s): 11.042.
- This funding opportunity was created on 2024-10-18.
- Applicants must submit their applications by 2024-12-20. (Agency may still review applications by suitable applicants for the remaining/unused allocated funding in 2026.)
- The number of recipients for this funding is limited to 10 candidate(s).
- Eligible applicants include: Others.
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